Xintec Inc. Overview
Pro stress-test →Xintec is a subcontractor of advanced packaging services in the semiconductor industry, engaging mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI) and testing services. The company provides these services for imaging sensors, biometric sensors, micromotors and power control components applied in camera phones, PC cameras, and security monitors, among other applications.
Strategic Profile
Pro stress-test →Xintec has a market capitalization of $1.96B with 271M shares as of May 2026. The company achieved net sales revenue growth of 2.53% in 2025. With 1,498 employees as of 2025, Xintec operates globally across Asia, the United States, and Europe, positioning itself as a specialized semiconductor packaging provider serving diverse applications from consumer electronics to automotive sectors.
Competitive Landscape
Pro stress-test →Xintec's top competitors include RRP Electronics, Amkor and Suchi Semicon. The company operates in a competitive semiconductor packaging landscape where it ranks 20th among 89 active competitors and 11th in terms of total funding among its competitors. Xintec differentiates through specialized optical sensor and MEMS packaging capabilities, competing against both larger global packaging providers and niche regional players.
Industry Context
Xintec Inc. operates in Semiconductor wafer-level packaging and testing services.
Key facts
Founded: 1998 · Headquarters: Taoyuan, Taiwan · Employees: 1,498 · Revenue: $232M · Market cap: $1.96B